Residual Stress in Multilayer NTC Thermistors during Bending Test

RyongJin O1, TaeYong Yun2, HyonGyu Pak3, NamChol Yu1* DOI: 10.5281/zenodo.17186628 GAS Journal of Engineering and Technology (GASJET) The stress occurred on the NTC (negative temperature coefficient) thermistor chip while serving process of the chip was investigated in this study. We Read More …